System Level Solutions has full fledge capability to offer board designs - from schematic to final Gerber release to suit customer manufacturing requirements. SLS board design team has good experience in high speed board designs, multi-layered, multi-CPU and high performance board designs.

Whether it’s a board design or a system design, increased complexity and reduced design time are the challenges our customers face. SLS board design team takes all responsibility/challenge with our clients to deliver the best quality designs at right time.

Design Procedure

• Requirements Analysis - Design and Architecture specification
• Design
  • Electronic component engineering
  • Power and Clock design
  • Enclosure Modeling, CAD Design
• Implementation
  • Schematic
  • Placement and Routing
  • Signal Integrity
• Prototyping
• Translation services
  • Fabrication
  • Assembly - In house
  • Packaging
  • Rapid Prototyping for Enclosures
• Diagnostics
  • Reliability analysis
  • Thermal analysis
  • Pre and post layout signal integrity check and cross talk analysis
  • EMI and EMC analysis

Design Capabilities:

• Schematic captures, Manual Routing
• High Density Multi-layer Boards designing
• Digital, Analog, Mixed Signal, Power and RF Designs
• High-speed design rules and cross talk management
• Blind and Buried via Designs
• EMI / EMC design guidelines
• BGA, Fine Line BGA & Micro-BGA Designs
• DUT/LOAD card design and Burn-in board designs
• RoHS Compliant Layout Design and fabrication

Complexity of Designs

• Split POWER/ GROUND Planes
• Number of Layers: Up to 24
• Bus Speeds: 1.4 GHz with 32bit width
• Controlled Impedance for Signals as well as Power Planes
• Different Bus Topologies
• Daisy Chain, Star and length Matched
• Memory Interface Types: DDR, RD RAM, SSRAM, SDRAM, Serial/Parallel Flash and Flash Cards
• High Speed I/O Interfaces: Multi Giga bit Serial Interface, High speed Ethernet, PCI Express, Optical Fiber,  VME Interface, RF Designs of 2.8 GHz
• Blind and Buried Via Designs
• Different Form Factors: PCI and PCI Express, PCI- Mezzanine, PCMCIA, PC103, Euro, Extended Euro
• Components Packages: Micro- BGA, BGB VME Connectors etc.

Design Tools Experience

• Cadence - OrCAD Capture
• Cadence - OrCAD PSPICE
• Cadence - OrCAD Layout
• Cadence - Allegro
• Mentor Graphics

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