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System Level Solutions has full fledge capability to offer board designs - from schematic to final Gerber release to suit customer manufacturing requirements. SLS board design team has good experience in high speed board designs, multi-layered, multi-CPU and high performance board designs.

Whether it’s a board design or a system design, increased complexity and reduced design time are the challenges our customers face. SLS board design team takes all responsibility/challenge with our clients to deliver the best quality designs at right time.


Design Procedure

  • Requirements Analysis - Design and Architecture specification
  • Design
    • Electronic component engineering
    • Power and Clock design
    • Enclosure Modeling, CAD Design
  • Implementation
    • Schematic
    • Placement and Routing
    • Signal Integrity
  • Prototyping
  • Translation services
    • Fabrication
    • Assembly - In house
    • Packaging
    • Rapid Prototyping for Enclosures
  • Diagnostics
    • Reliability analysis
    • Thermal analysis
    • Pre and post layout signal integrity check and cross talk analysis
    • EMI and EMC analysis


Design Capabilities:

  • Schematic captures, Manual Routing
  • High Density Multi-layer Boards designing
  • Digital, Analog, Mixed Signal, Power and RF Designs
  • High-speed design rules and cross talk management
  • Blind and Buried via Designs
  • EMI / EMC design guidelines
  • BGA, Fine Line BGA & Micro-BGA Designs
  • DUT/LOAD card design and Burn-in board designs
  • RoHS Compliant Layout Design and fabrication


Complexity of Designs

  • Split POWER/ GROUND Planes
  • Number of Layers: Up to 24
  • Bus Speeds: 1.4 GHz with 32bit width
  • Controlled Impedance for Signals as well as Power Planes
  • Different Bus Topologies
  • Daisy Chain, Star and length Matched
  • Memory Interface Types: DDR, RD RAM, SSRAM, SDRAM, Serial/Parallel Flash and Flash Cards
  • High Speed I/O Interfaces: Multi Giga bit Serial Interface, High speed Ethernet, PCI Express, Optical Fiber,  VME Interface, RF Designs of 2.8 GHz
  • Blind and Buried Via Designs
  • Different Form Factors: PCI and PCI Express, PCI- Mezzanine, PCMCIA, PC103, Euro, Extended Euro
  • Components Packages: Micro- BGA, BGB VME Connectors etc.


Design Tools Experience

  • Cadence - OrCAD Capture
  • Cadence - OrCAD PSPICE
  • Cadence - OrCAD Layout
  • Cadence - Allegro
  • Mentor Graphics


 What Clients say about us

The support services on the phone were commendable. Once we had SLS on the phone and in house they were very knowledgeable.

Erik Malone, Qualcomm (USA)

Your software & electronic hardware(PCB Design,assembly etc) design capability is world class.

S.K.Biswas, BHEL (Bhopal, India)

I would like to thank you for your excellent support and willingness to help. I am glad that I did get to know SLS.

Mauritz Zondagh, Saab (South Africa)

I'd like to congratulate the winners of the Echelon Innovator of the Year award. GreenWave Reality and SLS represent some of the very best customer benefits and technical achievements of the Smart Grid. 

Ron Sege, chairman & CEO of Echelon
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System Level Solutions Inc. 511 N. Washington Avenue,Marshall, Texas 75670. Ph: 001-408-852-0067